Multi-chip module
Encyclopedia : M : MU : MUL : Multi-chip module
A package (for an electronics part) which contains two or more silicon parts.
MCMs are classified according to the technology used to create the HDI (High Density Interconnection) substrate.
- MCM-L - laminated MCM. The substrate is a multi-layer laminated PCB (Printed circuit board).
- MCM-D - deposited MCM. The modules are deposited on the base substrate using thin film technology.
- MCM-C - ceramic substrate MCMs.
List of MCMs
- IBM Bubble memory MCMs (1970s)
- Intel Pentium_D Presler [link] and Xeon Dempsey and Clovertown
- Sony memory sticks
External links
- [Multi-Chip Modules] at CMAC MicroTechnology
- [Multichip Module Technology (MCM) or System on a Package (SoP)]
From Wikipedia, the Free Encyclopedia. Original article here. Support Wikipedia by contributing or donating.
All text is available under the terms of the GNU Free Documentation License See Wikipedia Copyrights for details.